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  wideband 4 ghz, 43 db isolation at 1 ghz, cmos 1.65 v to 2.75 v, 2:1 mux/spdt adg918/adg919 rev. c information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2003C2008 analog devices, inc. all rights reserved. features wideband switch: ?3 db @ 4 ghz absorptive/reflective switches high off isolation (43 db @ 1 ghz) low insertion loss (0.8 db @1 ghz) single 1.65 v to 2.75 v power supply cmos/lvttl control logic 8-lead msop and tiny 3 mm 3 mm lfcsp packages low power consumption (<1 a) applications wireless communications general-purpose rf switching dual-band applications high speed filter selection digital transceiver front end switch if switching tuner modules antenna diversity switching functional block diagrams rf2 rf1 ctrl adg918 rfc 50 ? 50 ? adg919 rf2 rf1 ctrl rfc 0 3335-001 figure 1. general description the adg918/adg919 are wideband switches using a cmos process to provide high isolation and low insertion loss to 1 ghz. the adg918 is an absorptive (matched) switch having 50 terminated shunt legs, whereas the adg919 is a reflective switch. these devices are designed such that the isolation is high over the dc to 1 ghz frequency range. they have on-board cmos control logic, thus eliminating the need for external controlling circuitry. the control inputs are both cmos and lvttl compatible. the low power consumption of these cmos devices makes them ideally suited to wireless and general-purpose high frequency switching applications. product highlights 1. C43 db off isolation @ 1 ghz. 2. 0.8 db insertion loss @ 1 ghz. 3. tiny 8-lead msop/lfcsp packages. frequency (hz) 10k 100k 1m 10m 100m 1g 10g ?100 ?90 ?70 ?60 ?50 ?40 ?30 ?80 ? 2 0 ?10 0 iso l a tion (db) s21 v dd = 2.5v t a = 25c s12 03335-003 figure 2. off isol ation vs. frequency frequency (hz) 10k 100k 1m 10m 100m 1g 10g ?3.2 ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0 . 8 ?0.6 ? 0.4 insertion loss (db) v dd = 2.5v t a = 25c 03335-004 figure 3. insertion loss vs. frequency
adg918/adg919 rev. c | page 2 of 16 table of contents features .............................................................................................. 1 ? applications ....................................................................................... 1 ? functional block diagrams ............................................................. 1 ? general description ......................................................................... 1 ? product highlights ........................................................................... 1 ? revision history ............................................................................... 2 ? specifications ..................................................................................... 3 ? absolute maximum ratings ............................................................ 5 ? esd caution .................................................................................. 5 ? pin configuration and function descriptions ............................. 6 ? typical performance characteristics ............................................. 7 ? terminology .................................................................................... 10 ? test circuits ..................................................................................... 11 ? applications information .............................................................. 13 ? absorptive vs. reflective switch ............................................... 13 ? wireless metering....................................................................... 13 ? tuner modules ............................................................................ 13 ? filter selection ............................................................................ 13 ? adg9xx evaluation board ........................................................... 14 ? outline dimensions ....................................................................... 15 ? ordering guide .......................................................................... 16 ? revision history 9/08rev. b to rev. c changes to ordering guide .......................................................... 16 8/08rev. a to rev. b changes to table 1, ac electrical characteristics, third order intermodulation intercept ............................................................... 3 updated outline dimensions ....................................................... 15 changes to ordering guide .......................................................... 16 9/04changed from rev. 0 to rev. a updated format .................................................................. universal change to data sheet title ............................................................... 1 change to features ............................................................................ 1 change to product highlights ......................................................... 1 changes to specifications ................................................................. 3 change to adg9xx evaluation board section ........................... 13 changes to ordering guide .......................................................... 14 8/03 revision 0: initial version
adg918/adg919 rev. c | page 3 of 16 specifications v dd = 1.65 v to 2.75 v, gnd = 0 v, input power = 0 dbm, all specifications t min to t max , unless otherwise noted. temperature range for b version: ?40c to +85c. table 1. b version parameter symbol conditions min typ 1 max unit ac electrical characteristics operating frequency 2 dc 2 ghz 3 db frequency 3 4 ghz input power 3 0 v dc bias 7 dbm 0.5 v dc bias 16 dbm insertion loss s 21 , s 12 dc to 100 mhz; v dd = 2.5 v 10% 0.4 0.7 db 500 mhz; v dd = 2.5 v 10% 0.5 0.8 db 1000 mhz; v dd = 2.5 v 10% 0.8 1.25 db isolationrfc to rf1/rf2 s 21 , s 12 100 mhz 57 60 db (cp package) 500 mhz 46 49 db 1000 mhz 36 43 db isolationrfc to rf1/rf2 s 21 , s 12 100 mhz 55 60 db (rm package) 500 mhz 43 47 db 1000 mhz 34 37 db isolationrf1 to rf2 (crosstalk) s 21 , s 12 100 mhz 55 58 (cp package) 500 mhz 41 44 1000 mhz 31 37 isolationrf1 to rf2 (crosstalk) s 21 , s 12 100 mhz 54 57 (rm package) 500 mhz 39 42 1000 mhz 31 33 return loss (on channel) 3 s 11 , s 22 dc to 100 mhz 21 27 db 500 mhz 22 27 db 1000 mhz 22 26 db return loss (off channel) 3 s 11 , s 22 dc to 100 mhz 18 23 db adg918 500 mhz 17 21 db 1000 mhz 16 20 db on switching time 3 t on 50% ctrl to 90% rf 6.6 10 ns off switching time 3 t off 50% ctrl to 10% rf 6.5 9.5 ns rise time 3 t rise 10% to 90% rf 6.1 9 ns fall time 3 t fall 90% to 10% rf 6.1 9 ns 1 db compression 3 p C1 db 1000 mhz 17 dbm third order intermodulation intercept ip 3 900 mhz/901 mhz, 4 dbm 28.5 36 dbm video feedthrough 4 2.5 mv p-p dc electrical characteristics input high voltage v inh v dd = 2.25 v to 2.75 v 1.7 v v inh v dd = 1.65 v to 1.95 v 0.65 v cc v input low voltage v inl v dd = 2.25 v to 2.75 v 0.7 v v inl v dd = 1.65 v to 1.95 v 0.35 v cc v input leakage current i i 0 v v in 2.75 v 0.1 1 a
adg918/adg919 rev. c | page 4 of 16 b version parameter symbol conditions min typ 1 max unit capacitance 3 rf on capacitance c rf on f = 1 mhz 1.6 pf ctrl input capacitance c ctrl f = 1 mhz 2 pf power requirements v dd 1.65 2.75 v quiescent power supply current i dd digital inputs = 0 v or v dd 0.1 1 a 1 typical values are at v dd = 2.5 v and 25c, unless otherwise stated. 2 point at which insertion loss degrades by 1 db. 3 guaranteed by design, not subject to production test. 4 the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setu p, measured with 1 ns rise time pulses an d 500 mhz bandwidth.
adg918/adg919 rev. c | page 5 of 16 absolute maximum ratings t a = 25c, unless otherwise noted. table 2. parameter rating v dd to gnd C0.5 v to +4 v inputs to gnd C0.5 v to v dd + 0.3 v 1 continuous current 30 ma input power 18 dbm operating temperature range industrial (b version) C40c to +85c storage temperature range C65c to +150c junction temperature 150c msop package ja thermal impedance 206c/w lfcsp package ja thermal impedance (2-layer board) 84c/w ja thermal impedance (4-layer board) 48c/w lead temperature, soldering (10 sec) 300c ir reflow, peak temperature (<20 sec) 235c esd 1 kv 1 rf1 and rf2 off port inputs to ground: ?0.5 v to v dd C 0.5 v. stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. esd caution
adg918/adg919 rev. c | page 6 of 16 pin configuration and fu nction descriptions top view (not to scale) 8 7 6 5 1 2 3 4 v dd ctrl gnd rfc rf1 gnd gnd rf2 adg918/ adg919 03335-002 figure 4. 8-lead msop (rm-8) and 8-lead 3 mm x 3 mm lfcsp (cp-8); exposed pad tied to substrate, gnd table 3. pin function descriptions pin no. mnemonic function 1 v dd power supply input. these parts can be operated from 1.65 v to 2.75 v, and v dd should be decoupled to gnd. 2 ctrl logic control input. see table 4 . 3, 6, 7 gnd ground reference point for all circuitry on the part. 4 rfc common rf port for switch. 5 rf2 rf2 port. 8 rf1 rf1 port. table 4. truth table ctrl signal path 0 rf2 to rfc 1 rf1 to rfc
adg918/adg919 rev. c | page 7 of 16 typical performance characteristics ? 0 . 8 v dd = 2.25v v dd = 2.75v t a = 25c insertion loss (db) ?3.2 ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ?0.6 ?0.4 ? 0.2 frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-017 v dd = 2.5v figure 5. insertion loss vs. frequency over supplies (rf1/rf2, s12, and s21) t a = 25c ?0.75 ?0.65 ?0.60 ?0.55 ?0.50 ?0.45 ?0.70 ? 0 . 4 0 ?0.35 ?0.30 insertion loss (db) ?0.80 frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-019 v dd = 2.75v v dd = 2.5v v dd = 2.25v figure 6. insertion loss vs. fr equency over supplies (rf1/rf2, s12, and s21) (zoomed figure 5 plot) ?3.2 ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0 . 8 ?0.6 ?0.4 ? 0.2 v dd = 1.65v t a = 25c v dd = 1.8v insertion loss (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-021 v dd = 1.95v figure 7. insertion loss vs. frequency over supplies (rf1/rf2, s12, and s21) +85c v dd = 2.5v ?40c +25c ?3.2 ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0 . 8 ?0.6 ?0.4 ? 0.2 insertion loss (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-018 figure 8. insertion loss vs. frequency over temperature (rf1/rf2, s12, and s21) ? 2 0 s12 s21 v dd = 1.65v to 2.75v t a = 25c ?90 ?70 ?60 ?50 ?40 ?30 ?80 ?10 0 iso l a tion (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-020 figure 9. isolation vs. frequency over supplies (rf1/rf2, adg918) s12 s21 v dd = 1.65v to 2.75v t a = 25c ?90 ?70 ?60 ?50 ?40 ?30 ?80 ? 2 0 ?10 0 iso l a tion (db) ?100 frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-022 figure 10. isolation vs. frequency over supplies (rf1/rf2, adg919)
adg918/adg919 rev. c | page 8 of 16 ? 2 0 frequency (hz) 10k 100k 1m 10m 100m 1g 10g v dd = 2.5v s12 (+85c) s12 (+25c) s12 (?40c) ?90 ?70 ?60 ?50 ?40 ?30 ?80 ? 10 iso l a tion (db) ?100 s21 03335-023 (?40c, +25c, +85c) figure 11. isolation vs. frequency over temperature (rf1/rf2, adg919) t a = 25c v dd = 2.5v off switch (adg918) on switch ?35 ?40 ?30 ?25 ?20 ?15 ? 1 0 ?5 0 return loss (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-026 figure 12. return loss vs. frequency (rf1/rf2, s11) ? 1 5 t a = 25c v dd = 2.5v ?35 ?30 ?25 ?20 ?55 ?50 ?45 ?40 ? 10 crosstalk (db) ?70 ?60 ?65 ?75 ?80 frequency (hz) 10k 100k 1m 10m 100m 1g 10g 03335-028 figure 13. crosstalk vs. freq uency (rf1/rf2, s12, s21) ch1 = ctrl = 1v/div t rise = 6.1ns ch2 = rf1 = 100mv/div t fall = 6.1ns ch3 = rf2 = 100mv/div ch2/3 ch1 03335-024 figure 14. switch timing ch1 500mv ch2 1mv ? m 10.0ns ctrl rfc ch2 p-p 2.002mv 03335-027 figure 15. video feedthrough 40 35 250 350 450 550 frequency (mhz) 650 750 850 30 ip 3 (dbm) 25 20 15 10 5 0 v dd = 2.5v t a = 25c 03335-029 figure 16. ip3 vs. frequency
adg918/adg919 rev. c | page 9 of 16 20 0 250 500 750 1000 1250 frequency (mhz) 1500 p ?1db (dbm) 2 4 6 8 10 12 14 16 18 0 v dd = 2.5v t a = 25c 03335-025 figure 17. p-1 db vs. frequency
adg918/adg919 rev. c | page 10 of 16 terminology v dd most positive power supply potential. i dd positive supply current. gnd ground (0 v) reference. ctrl logic control input. v inl maximum input voltage for logic 0. v inh minimum input voltage for logic 1. i inl (i inh ) input current of the digital input. c in digital input capacitance. t on delay between applying the digital control input and the output switching on. t off delay between applying the digital control input and the output switching off. t rise rise time; time for the rf signal to rise from 10% to 90% of the on level. t fall fall time; time for the rf signal to fall from 90% to 10% of the on level. off isolation the attenuation between the input and output ports of the switch when the switch control voltage is in the off condition. insertion loss the attenuation between the input and output ports of the switch when the switch control voltage is in the on condition. p C1 db 1 db compression point. the rf input power level at which the switch insertion loss increases by 1 db over its low level value. it is a measure of how much power the on switch can handle before the insertion loss increases by 1 db. ip 3 third order intermodulation intercept. this is a measure of the power in false tones that occur when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. return loss the amount of reflected power relative to the incident power at a port. large return loss indicates good matching. by measuring return loss, the vswr (voltage standing wave ratio) can be calculated from conversion charts. vswr indicates the degree of matching present at a switch rf port. video feedthrough spurious signals present at the rf ports of the switch when the control voltage is switched from high to low or low to high without an rf signal present.
adg918/adg919 rev. c | page 11 of 16 test circuits setups for the adg918 are similar. t on 50% 50% 90% 10% v ctrl v out t off v dd v dd 0.1f v s ctrl rfx rfc gnd r l 50 ? v out 03335-009 figure 18. switch timing: t on , t off v ctrl v out 50% 50% 90% 90% 10% 10% t fall t rise v dd v dd 0.1f v s ctrl rfx rfc gnd r l 50 ? v out 03335-010 figure 19. switch v s network analyzer v ctrl off isolation = 20log v out v s v dd 0.1f v dd 50? v out r l 50? adg919 rf2 rf1 ctrl rfc gnd 50? 03335-011 figure 20. off isolation v s network analyzer v ctrl insertion loss = 20log v out v s v dd v dd 0.1f 50? v out r l 50 ? adg919 rf2 rf1 ctrl rfc gnd 50? 03335-012 figure 21. insertion loss v s network analyzer v ctrl crosstalk = 20log v out v s v dd 0.1f v dd 50 ? v out r l 50? adg919 rf2 rf1 ctrl rfc gnd 50? 03335-013 figure 22. crosstalk v ctrl v dd 0.1f v dd adg919 rf2 rf1 ctrl rfc gnd nc nc oscilloscope 03335-014 figure 23. video feedthrough
adg918/adg919 rev. c | page 12 of 16 spectrum analyzer v ctrl v dd 0.1f v dd adg919 rf2 rf1 ctrl rfc gnd 50? combiner rf source rf source 03335-015 figure 24. ip 3 spectrum analyzer v ctrl v dd 0.1f v dd adg919 rf2 rf1 ctrl rfc gnd 50? rf source v s 03335-016 figure 25. p -1 db
adg918/adg919 rev. c | page 13 of 16 applications information the adg918/adg919 are ideal solutions for low power, high frequency applications. the low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. the most obvious application is in a transmit/receive block, as shown in the wireless metering block diagram in figure 26. other applications include switching between high frequency filters, an ask generator, an fsk generator, and an antenna diversity switch in many tuner modules. absorptive vs. reflective switch the adg918 is an absorptive (matched) switch with 50 terminated shunt legs, and the adg919 is a reflective switch with 0 terminated shunts to ground. the adg918 absorptive switch has a good vswr on each port, regardless of the switch mode. an absorptive switch should be used when there is a need for a good vswr that is looking into the port but not passing the through signal to the common port. the adg918 is there- fore ideal for applications that require minimum reflections back to the rf source. it also ensures that the maximum power is transferred to the load. the adg919 reflective switch is suitable for applications where high off port vswr does not matter and the switch has some other desired performance feature. it can be used in many applications, including high speed filter selection. in most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. wireless metering the adg918 can be used in wireless metering applications. it can be used in conjunction with the adf7020 transceiver ic for a utility metering transceiver application, providing the required isolation between the transmit and receive signals. the spdt configuration isolates the high frequency receive signal from the high frequency transmit. lna antenna tx/rx switch pa adg918 03335-005 figure 26. wireless metering tuner modules the adg918 can be used in a tuner module to switch between the cable tv input and the off-air antenna. this part is also ideal for use as an antenna diversity switch, switching different antenna to the tuner. vga antenna cable adg918/ adg919 tuner 03335-006 figure 27. tuner modules filter selection the adg919 can be used as a 2:1 demultiplex to switch high frequency signals between different filters and also to multiplex the signal to the output. adg919 adg919 rf1 rf2 rf1 rf2 rfc rf out rf in rfc 03335-007 figure 28. filter selection
adg918/adg919 rev. c | page 14 of 16 adg9xx evaluation board the adg9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. in addition to the evaluation board, the user requires only a power supply and a network analyzer. an application note is available with the evaluation board and gives complete information about operating the evaluation board. the rfc port (see figure 29) is connected through a 50 transmission line to the top left sma connector j1. rf1 and rf2 are connected through 50 transmission lines to the top two sma connectors, j2 and j3 respectively. a through trans- mission line connects j4 and j5 and is used to estimate the loss of the pcb over the environmental conditions being evaluated. the board is constructed of a 4-layer, fr4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 inches. two ground layers with grounded planes provide ground for the rf transmission lines. the transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, a clearance to ground plane of 0.030 inches, a dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches. 03335-008 figure 29. adg9xx evaluation board top view
adg918/adg919 rev. c | page 15 of 16 outline dimensions compliant to jedec standards mo-187-aa 0.80 0.60 0.40 8 0 4 8 1 5 pin 1 0.65 bsc seating plane 0.38 0.22 1.10 max 3.20 3.00 2.80 coplanarity 0.10 0.23 0.08 3.20 3.00 2.80 5.15 4.90 4.65 0.15 0.00 0.95 0.85 0.75 figure 30. 8-lead mini small outline package [msop] (rm-8) dimensions shown in millimeters exposed pad is connected internal ly. for increased reliabilit y of the solder joints and maximum thermal capability it is recommended that the pad be soldered to the ground plane. 061507-b 1 exposed pa d (bottom view) 0.50 bsc pin 1 indicator 0.50 0.40 0.30 top view 12 max 0.70 max 0.65 typ 0.90 max 0.85 nom 0.05 max 0.01 nom 0.20 ref 1.89 1.74 1.59 4 1.60 1.45 1.30 3.25 3.00 sq 2.75 2.95 2.75 sq 2.55 5 8 pin 1 indicator s eating plane 0.30 0.23 0.18 0.60 max 0.60 max figure 31. 8-lead lead frame chip scale package [lfcsp_vd] 3 mm x 3 mm body, very thin, dual lead (cp-8-2) dimensions shown in millimeters
adg918/adg919 rev. c | page 16 of 16 ordering guide model temperature range package description package option branding adg918brm C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b adg918brm-500rl7 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b adg918brm-reel C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b adg918brm-reel7 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b ADG918BRMZ 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b# ADG918BRMZ-500rl7 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b# ADG918BRMZ-reel 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b# ADG918BRMZ-reel7 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 w4b# adg918bcp-500rl7 C40c to +85c 8-lead lead fr ame chip scale package (lfcsp_vd) cp-8-2 w4b adg918bcp-reel7 C40c to +85c 8-lead lead fr ame chip scale package (lfcsp_vd) cp-8-2 w4b adg918bcpz-500rl7 1 C40c to +85c 8-lead lead frame chip scale package (lfcsp_vd) cp-8-2 w4b# adg918bcpz-reel7 1 C40c to +85c 8-lead lead frame chip scale package (lfcsp_vd) cp-8-2 w4b# adg919brm C40c to +85c 8-lead mini small outline package (msop) rm-8 w5b adg919brm-500rl7 C40c to +85c 8-lead mini small outline package (msop) rm-8 w5b adg919brm-reel C40c to +85c 8-lead mini small outline package (msop) rm-8 w5b adg919brm-reel7 C40c to +85c 8-lead mini small outline package (msop) rm-8 w5b adg919brmz 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 s1x adg919brmz-reel 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 s1x adg919brmz-reel7 1 C40c to +85c 8-lead mini small outline package (msop) rm-8 s1x adg919bcp-500rl7 C40c to +85c 8-lead lead fr ame chip scale package (lfcsp_vd) cp-8-2 w5b adg919bcp-reel7 C40c to +85c 8-lead lead fr ame chip scale package (lfcsp_vd) cp-8-2 w5b adg919bcpz-reel7 1 C40c to +85c 8-lead lead frame chip scale package (lfcsp_vd) cp-8-2 s1x eval-adg918ebz 1 evaluation board eval-adg919ebz 1 evaluation board 1 z = rohs compliant part, # denotes rohs compliant product, may be top or bottom marked. ?2003C2008 analog devices, inc. all rights reserved. trademarks and registered trademarks are the prop erty of their respective owners. d03335-0-9/08(c)


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